1. To be able thoroughly grind off the letters on the surface of IC to prevent the circuit board from being counterfeited.
2. To use automatic material feeding and recovering without hand touching the material to prevent form electrostatic interference.
3. To grind with special grinding wheel plate without causing surface being heated, the depth of the grinding may be micro-adjusted.
4. To fit with diamond rectify to adjust the plane of the grinding wheel plate at any time when necessary.
5. With small volume and high production efficiency, The productivity of one machine is equivalent to five skilled labors.
6. The machine is suitable for D.I.P IC type and S.M.D. IC type.
   (SOP, SOJ and PLCC type etc.)

ICF-840